接地孔效应前置的微带交指滤波器设计

文数文; 高杨; 许夏茜

doi:10.11884/HPLPB201830.180093

接地孔效应前置的微带交指滤波器设计

doi: 10.11884/HPLPB201830.180093

1.
西南科技大学信息工程学院, 四川绵阳 621010
2.
中国工程物理研究院电子工程研究所, 四川绵阳 621999

基金项目:

国家自然科学基金项目 61574131

核探测与核电子学国家重点实验室开放课题基金项目 2016KF-02

西南科技大学特殊环境机器人技术四川省重点实验室开放基金项目 14ZXTK01

详细信息

作者简介:
文数文(1992—), 男, 硕士, 从事微电子机械系统研究; 505672577@qq.com

高杨(1972—), 男, 博士, 研究员, 从事微电子机械系统研究; gaoyang@caep.cn

中图分类号: TN631.2;TN713
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- 被引次数: 0
出版历程
- 收稿日期: 2018-03-30
- 修回日期: 2018-04-21
- 刊出日期: 2018-08-15

Grounding via-hole effect pre-considered microstrip interdigital filter design

1.
School of Information Engineering, Southwest University of Science and Technology, Mianyang 621010, China
2.
Institute of Electronic Engineering, CAEP, Mianyang 621999, China

摘要

摘要: 微带交指滤波器通常需要使用接地孔接地，传统的设计方法是在整体建模时再考虑接地孔的影响，导致了接地孔的个数、大小、位置都不确定的多因素、多水平问题，因此可以在设计过程中提前考虑接地孔的影响来避免这些问题。以Ka波段滤波器为案例，分别使用了传统的奇偶模阻抗法、耦合系数和外部品质因数法以及在设计过程中考虑了接地孔的改进方法进行设计。初始设计结果显示，传统方法的中心频率发生偏移，并且其他参数与设计指标相差甚远，而改进方法的中心频率、通带范围以及带外抑制满足指标要求，并且最大插入损耗为3.08 dB，最小回波损耗为10.08 dB，有利于减少后续迭代次数。
- 微电子机械系统 /
- 滤波器 /
- 交指 /
- 微带线 /
- 接地孔 /
- 设计
Abstract: Via-holes are usually required to ground for microstrip interdigital filter.The influence of the grounding via-hole is considered when modeling the overall system in traditional design methods, which will lead to the multi-factor and multi-level problem since the number, size and position of the grounding via-holes are uncertain.The problems can be avoided by proposing grounding via-hole effect in microstrip interdigital filter design.Taking Ka-band filter as an example, the traditional odd-even mode impedance method, coupling coefficient and external quality factor method, and the modification method of considering the grounding via-holes in the design process are used to design the filter respectively.The initial design results show that the center frequency of the traditional method is shifted to the left, and other parameters are much different from the design specification.The center frequency, passband range and stop rejection of the modification method meet the requirements of the specification, and the maximum insertion loss is 3.08 dB, the minimum return loss is 10.08 dB, which is helpful to reduce the subsequent iterations.
- MEMS /
- filter /
- interdigital /
- microstrip line /
- grounding via-hole /
- design

HTML全文

图 1 微带交指滤波器接地孔金属化层厚度不同的性能对比

Figure 1. Performance comparison of different thickness of metallized layer in grounding via-holes of microstrip interdigital filter

下载: 全尺寸图片幻灯片

图 2 奇偶模阻抗法得到的交指滤波器初始设计结果

Figure 2. Initial design results of interdigital filter obtained by even and odd mode impedance method

下载: 全尺寸图片幻灯片

图 3 耦合系数和外部品质因数法得到的交指滤波器初始设计结果

Figure 3. Initial design results of interdigital filter obtained by coupling coefficient and external quality factor method

下载: 全尺寸图片幻灯片

图 4 添加了接地孔的谐振器S₁₁曲线

Figure 4. S₁₁ of single resonator with grounding via-holes

下载: 全尺寸图片幻灯片

图 5 添加了接地孔的对称耦合谐振器S参数曲线

Figure 5. S parameter of two symmetrically coupled resonators with grounding via-holes

下载: 全尺寸图片幻灯片

图 6 添加了接地孔的输入/输出谐振器群时延

Figure 6. Group delay of input / output resonator with grounding via-holes

下载: 全尺寸图片幻灯片

图 7 改进方法得到的交指滤波器初始设计结果与后续优化结果

Figure 7. Initial design results and subsequent optimization results of interdigital filter obtained by modify method

下载: 全尺寸图片幻灯片

表 1 滤波器设计指标

Table 1. Design specification of the filter

center frequency/GHz	passband frequency range/GHz	passband ripple/dB	insertion loss/dB	return loss/dB	stop rejection/dB
30.19	29.4~31	1	2~3	17.7	≥30@27 GHz&33.4 GHz

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表 2 交指滤波器的奇偶模阻抗值

Table 2. Even and odd mode impedances of the interdigital filter

i	Z_{0ei, i+1}	Z_{0oi, i+1}
1	51.80	48.20
2	51.29	48.65
3	51.29	48.65
4	51.80	48.20

下载: 导出CSV

表 3 交指带通滤波器的奇偶模相对介电常数和间距

Table 3. Even and odd mode relative dielectric constants and spacing of the interdigital bandpass filter

i	ε_rei^e	ε_rei^o	s_{i, i+1}/mm
1	7.999	7.784	1.066 3
2	7.981	7.821	1.394 2
3	7.962	7.857	1.394 2
4	7.981	7.821	1.066 3
5	7.999	7.784	—

下载: 导出CSV

表 4 耦合系数M，K与谐振器间距s

Table 4. Coupling coefficients M, K and resonator spacing s

i	M	K	s/mm
1~2	0.045 91	0.046 1	0.645
2~3	0.033 71	0.033 8	0.75
3~4	0.033 71	0.033 8	0.75
4~5	0.045 91	0.046 1	0.645

下载: 导出CSV

参考文献(13)

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