切削参数对KDP晶体加工表面实际频率特征的影响

况良杰; 庞启龙; 陈明君; 马鲁强; 徐幼林

doi:10.11884/HPLPB202032.190262

切削参数对KDP晶体加工表面实际频率特征的影响

doi: 10.11884/HPLPB202032.190262

1.
南京林业大学机械电子工程学院，南京 210037
2.
哈尔滨工业大学精密工程研究所，哈尔滨 150001

基金项目: 江苏省基础研究计划青年基金项目（BK20170930）；国家林业局948项目（2015-4-56）

详细信息

作者简介:
况良杰（1994—），男，硕士研究生，主要从事光学晶体超精加工表面形貌分析；liangjiekuang@gmail.com

通讯作者:
庞启龙（1979—），男，博士，主要从事表面微观结构的分析与重构；qlpang@njfu.edu.cn

中图分类号: TH161+.14
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出版历程
- 收稿日期: 2019-07-10
- 修回日期: 2019-12-17
- 刊出日期: 2020-02-10

Research on influence of cutting parameters on frequency characteristics of KDP surface topography

1.
College of Mechatronics Engineering, Nanjing Forestry University, Nanjing 210037, China
2.
Center for Precision Engineering, Harbin Institute of Technology, Harbin 150001, China

摘要

摘要: 针对采用单点金刚石超精加工的KDP晶体光学表面，研究了切削参数对微观形貌频率特征的影响。通过功率谱密度获得表面轮廓频率分布，并用连续小波重构加工过程中随切削用量变化的微观轮廓频率特征。结果表明：切削参数对微观形貌的影响具体表现在实际频率特征上,中频特征波长及幅值反映了切深及转速变化，随切深及转速增加，幅值变大；低频特征反映了进给量变化，随着进给量变小，频率及幅值变小；高频特征是加工过程中振动及材料各向异性的具体表现。
- 频率特征 /
- 表面形貌 /
- 切削参数 /
- 功率谱密度（PSD） /
- 连续小波变换（CWT）
Abstract: The influence of cutting parameters on the frequency characteristics of optical crystal surface has been studied. The experiment of single point diamond turning was adopted to process KDP crystal. The frequency distribution of surface profile was obtained by power spectral density. The continuous wavelet method was used to evaluate the influence of cutting depth, feed rate and spindle speed on machined surface. The results show that the frequency characteristics reflect the effects of cutting parameters on surface topography. The wavelength and amplitude of mid frequency embody the change of cutting depth and spindle speed, and the amplitude increases with the increase of cutting depth and speed. Low frequency reflects the change of feed rate, and the amplitude becomes small as feed rate decreases. High frequency is the manifestation of vibration and material anisotropy in processing. Therefore the analysis of frequency characteristics on surface topography provides a reference for selecting the optimal process parameters.
- frequency characteristics /
- surface topography /
- cutting parameters /
- power spectrum density (PSD) /
- continuous wavelet transform (CWT)

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图 1 白光干涉仪测量的变切削深度时晶体表面和轮廓

Figure 1. Crystal surface and contour at different cutting depth measured by a white light interferometer

下载: 全尺寸图片幻灯片

图 2 白光干涉仪测量的变进给量时晶体表面和轮廓

Figure 2. Crystal surface and contour at different feed rate measured by a white light interferometer

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图 3 白光干涉仪测量的主轴转速改变时晶体表面和轮廓

Figure 3. Crystal surface and contour at different spindle speed measured by a white light interferometer

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图 4 变切削深度时PSD计算结果

Figure 4. Results of PSD at different depth of cut

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图 5 变进给量时PSD计算结果

Figure 5. Results of PSD at different feed rate

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图 6 变主轴转速时PSD计算结果

Figure 6. Results of PSD at different spindle speed

下载: 全尺寸图片幻灯片

图 7 变切削深度时原始轮廓与实际频率特征比较

Figure 7. Comparison of surface profile and actual frequency characteristics at different depth of cut

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图 8 变进给量时原始轮廓与实际频率特征比较

Figure 8. Comparison of surface profile and actual frequency characteristics at different feed rate

下载: 全尺寸图片幻灯片

图 9 变主轴转速时原始轮廓与实际频率特征比较

Figure 9. Comparison of surface profile and actual frequency characteristics at different spindle speed

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表 1 圆弧刃天然单晶金刚石车刀参数

Table 1. Parameters of diamond turning tool

nose radius r/mm	edge radius r_n/nm	rake angle γ₀/(°)	clearance angle α₀/(°)
3.2	150	0	9

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表 2 切削参数及其轮廓均方根比较

Table 2. Cutting parameters and RMS of contour

No.（group）	spindle speed n/(r/min)	feed rate f /(μm/r)	depth of cut a_p/μm	RMS of contour R_q/nm
1	400	10	3	17
			6	35
			9	37
2	300	8	3	15
			12	24
			18	27
3	500	10	5	25
			400	24
			300	26

下载: 导出CSV

表 3 尺度因子及其计算过程参数

Table 3. Scale a and its parameters of calculations

	frequency f/μm⁻¹	size L/μm	number N	waviness central frequency f_s	mexihat central frequency f_c	sampling period Δ	scale a
low	0.005 6	360	256	0.015 8	0.25	1.412	11.209 3
low	0.008 4			0.023 7			7.472 9
mid	0.011 2			0.031 2			5.674 8
mid	0.013 8			0.038 8			4.563 2
high	0.027 7			0.077 9			2.272 8

下载: 导出CSV

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