强流脉冲电子束轰击下回喷靶材速度测量与数值模拟
Measurement and simulation of the back-ejecta of tantalum target material impacted by high intensity current pulse electron beam
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摘要: 叙述了用高速摄影技术研究强流脉冲电子束与钽金属靶相互作用后靶材的回喷现象，得出了靶材回喷的速度。并且采用EGS4程序和Euler流体力学方程组分别模拟了电子束在靶内的能量沉积和束靶相互作用的动力学过程。实验表明，钽金属靶在强流脉冲电子束轰击下，回喷靶材的轴向速度大于2.9 mm/μs,而模拟结果表明理想情况下回喷靶材自由面的轴向速度可达9.7 mm/μs。实验和理论计算为阻挡回喷靶材的快门设计提供了必要的参数。Abstract: Fast photography is used to investigate the back-ejecta of tantalum target material after interaction with high intensity current pulse electron beam. Velocity of back jecta of tantalum target material is presented. The electron beam energy deposition and the beam-target interaction dynamics is also computed numerically by EGS4 program and solving the series of Euler equations for mass, momentum and energy respectively.The experimental result shows that the axial velocity of back ejecta target material is faster than 2.9 mm/μs, while the simulation gives a velocity of 9.7 mm/μs under the ideal conditions. Both results give the necessary parameters for the shutter used to block off the target ejecta．
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Key words:
- pulse electron beam /
- beam-target interaction /
- back-ejecta /
- fast photography
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