微通道冷却器的数值分析
Numerical simulation of a microchannel cooler
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摘要: 微通道热沉是制作在硅芯片基底背面的微细通道，其水力直径范围为10~1 000 μm。微通道具有高表面积-体积比、低热阻、低流量等特点，是一种高效散热的解决方案。一个典型应用是激光二极管列阵的致冷。然而，微通道里流体的状态和传热与宏观状态相比有很大不同，有必要开展进一步研究。论文采用商业软件CoventorWareTM建立一个平板式微通道的有限元模型，据此对微通道中流体状态及传热进行了数值计算，获得了单个微通道中流场和温度的分布。结果表明，对于2 000 μm×50 μm×500 μm的微通道，能够对500 W/cm2的热通量快速散热，热阻仅有0.042 3 K/（W·cm-2）。Abstract: Microchannel heat sinks are minute channels fabricated onto the back of the thin silicon chip substrate with hydraulic diameter ranging from 10 to 103 μm. Microchannels have the advantage of large surface area to volume ratio, low thermal resistances and low flux, so they are thought to be an effective solution in dissipating thermal. One typical application is the cooling of the laser diode arrays. Because flow and heat transfer in microchannel are different from those in macro one, further research is necessary. An FEA (finite element analysis) model of a flat plate microchannel is set up in this paper using commercial software CoventorWareTM to investigate the localized flow and heat transfer in a single microchannel, computation results are also presented and analyzed. Microchannel is
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Key words:
- micro electromechanical system /
- microchannel /
- cooler
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