泡沫镍制备中化学镀镍研究
Electroless plating in synthesizing nickel foams
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摘要: 探讨了泡沫镍制备过程中，聚氨酯泡沫模板上的低温化学镀镍工艺，考察了镀液温度、pH值、主盐与还原剂浓度对沉积速率的影响。得出了适宜的工艺条件：硫酸镍30 g/L、次亚磷酸钠30 g/L、柠檬酸钠10 g/L、氯化铵30 g/L,镀液pH=9.0～9.5、温度45 ℃。在该工艺条件下，化学镀过程稳定，沉积速率可达40 mg/(cm3×h)。化学镀镍后经电镀、热解和还原退火处理制得泡沫镍，其样品呈3维网络状结构，密度为0.74 g/cm3,孔隙率为91.7%。Abstract: The technique of low-temperature electroless-plating nickel on the polyurethane foam in synthesizing nickel foams was investigated. The main factors affecting the deposition rate such as temperature, pH value, the concentration of nickle sulfate and reducing agent were explored. The obtained optimum process conditions are 30 g/L NiSO4, 30 g/L NaH2PO2, 10 g/L Na3C6O7H6, 30 g/L NH4Cl, 9.0～9.5 pH value at the reaction temperature of 45 ℃. In this technical condition, the process is stable with the deposition rate of 40 mg/(cm3·h). Nickel foams with a density of 0.74 g·cm-3 and a hole-rate of 91.7% was fabricated by electrodeposition, pyrogenation and deoxidization annealing after the electroless plating.
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Key words:
- electroless plating nickel /
- nickel foam /
- polyurethane /
- deposition rate
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