Al/Cu薄膜真空扩散连接技术
Vacuum diffusion bonding technology of aluminum/copper films
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摘要: 针对惯性约束聚变（ICF）物理实验要求，提出并采用真空扩散连接技术，在高温环境下对Al/Cu薄膜进行连接研究。利用扫描电子显微镜（SEM）、X射线衍射（XRD）仪以及台阶仪等方法对连接样品基体组织和表面质量进行分析。结果表明：铝铜薄膜通过界面原子间的范德华力、冶金结合以及界面反应实现无胶连接。Abstract: According to the requirement of the ICF experiments, the vacuum diffusion bonding of the aluminum and copper films were studied in high temperature circumstances(250℃). The microstructures of the joint and surface roughness are analyzed by means of SEM, XRD and an alpha-step device. The results show that the force among atoms, metallurgy combination and interface reaction are important to obtain the high quality joint of the aluminum and copper films.
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Key words:
- inertial confinement fusion(icf) /
- diffusion bonding /
- aluminum /
- copper /
- film
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