Abstract: The foamed copper was synthesized by electrodeposition technique on the basis of electroless copper plating using sodium hypophosphite as reductant. Micro-structure of foamed copper in different phase was characterized by scanning electron microscope and X-ray diffraction instruments. Small grain size and homogeneous copper in the foam silk were obtained by electroless plating. The electrodeposited copper was composed of 0.55 μm granules and there were some big granules in the middle of the electrodeposed copper silk. After heat treatment at 700 ℃, the granules crystal in the silk were dissolved, and the copper grains were bigger. Three-dimensional network foamed copper with compact crystal, density of 0.19 g/cm3, pore diameter ranged from 400 to 600 μm, and porosity of 97.9% was prepar