基底材料对磁控共溅射Al-Cu-Fe薄膜特性的影响
Effect of substrates on characteristics of magneticco-sputtering Al-Cu-Fe thin films
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摘要: 采用磁控共溅射工艺来制备Al-Cu-Fe薄膜，选用抛光状态的纯Al、纯Cu和不同粗糙度的不锈钢基作为基底材料。通过原子力显微镜分析薄膜的表面形貌，利用扫描电镜能谱仪分析薄膜的元素含量；通过MTS纳米力学综合测试系统分析薄膜的结合强度和摩擦因数。分析结果表明：不锈钢作为基底材料的薄膜与基体的结合强度最大，其次为纯铝和纯铜。纯铜基底薄膜的摩擦因数最大，达到0.17，其余两种薄膜的摩擦因数均不大于0.03。而薄膜表面形貌与基底材料的原始形貌有直接的联系，基底原始粗糙度越小，薄膜的表面组织也越细；基底原始粗糙度越大，薄膜表面形成的晶粒的团聚越明显。Abstract: Al-Cu-Fe thin films were successfully deposited by magnetron co-sputtering. The substrates were pure Al, pure Cu in polished state and the stainless steel with different surface roughness. The surface morphologies of the films were observed by Atomic Force Microscopy(AFM). The element compositions of the films were analyzed by Energy Dispersive Spectrum(EDS), and the bond strength and friction coefficient of the films were determined by nanoindentation (MTS systems). The results showed that the bond strength of the film for the stainless steel substrate was the biggest. The friction coefficient of the film with pure Cu substrate was 0.17, while the other films were not more than 0.03. The surface morphology of films was related with the initial surface morphology of the substrates. The sm
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Key words:
- al-cu-fe thin films /
- magnetron co-sputtering /
- substrate /
- surface morphology /
- bond strength /
- roughness
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