溅射功率对Mo薄膜微结构和性能的影响

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Effects of sputtering power on structure and property of Mo films deposited by DC magnetron sputtering

1.
School of Physics and Electronic Information,China West Normal University,Nanchong 637002,China;
2.
Science and Technology on Plasma Physics Laboratory,Research Center of Laser Fusion,CAEP,P.O.Box 919-987,Mianyang 621900,China

摘要: 实验采用直流磁控溅射沉积技术在不同溅射功率下制备Mo膜,研究了不同溅射功率下Mo膜的沉积速率、表面形貌及晶型结构,并对其晶粒尺寸和应力进行了研究。利用原子力显微镜观察样品的表面形貌发现随着溅射功率的增加,薄膜表面粗糙度逐渐增大。X射线衍射分析表明薄膜呈立方多晶结构,晶粒尺寸为14.1～17.9 nm;应力先随溅射功率的增大而增大,在40 W时达到最大值(2.383 GPa),后随溅射功率的增大有所减小。
- 直流磁控溅射 /
- Mo薄膜 /
- 溅射功率 /
- 表面形貌 /
- X射线衍射
Abstract: Mo films were fabricated at different sputtering powers by DC magnetron sputtering. The deposition rate, surface topography and crystal structure of Mo films were studied. The effects of sputtering power on grain size and stress of Mo films were discussed. AFM analyses show that when sputtering power increases from 20 W to 100 W, the roughness of Mo films raises. The X-ray diffraction analysis indicates that all the films are in cubic polycrystal structure. The grain size varies from 14.1 nm to 17.9 nm, and the stress in the Mo films increases firstly and then decreases as the sputtering power increases, reaching a maximum of 2.383 GPa at the sputtering power of 40 W.
- dc magnetron sputtering /
- mo film /
- sputtering power /
- surface topography /
- x-ray diffraction

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