Transient radiation damage effect of bipolar transistor load
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摘要: 利用有源传输线模型与漂移-扩散模型的耦合计算模型,对在瞬态X射线辐照下电缆末端典型N+-p-n-N+结构的双极晶体管负载的毁伤效应与规律进行研究,通过分析双极晶体管内部晶格温度分布,判定是否处于毁伤状态,总结双极晶体管烧毁时间和烧毁所需能量与脉冲X射线脉冲宽度和注量之间的关系。结果表明:随着脉冲X射线脉宽增加,双极晶体管烧毁能量变化较小,烧毁时间逐渐增加;随着注量增加,烧毁时间逐渐降低,在5.86 J/cm2以下时,烧毁所需能量基本相同,之后呈指数逐渐增加,并通过曲线拟合得到损伤规律的经验公式。Abstract: Using the transmission line and drift diffusion coupling model (TLM-DDM), this paper analyzes the damage effect and mechanism of the silicon bipolar transistor induced by the cable under the X-ray pulse. The result shows that the damage effect can be decided by the lattice temperature of the bipolar transistor, and the burnout point appears first near the n-N+ interface above the center of the collector region. The paper also describes the relationships of the damage energy and burnout time with the X-ray pulse width and fluence in the curve fitting. When the pulse width of the X-ray increases, the damage energy is almost unchanged and the burnout time increases gradually. The burnout time reduces as the X-ray fluence increases, and the damage energy increases after the X-ray fluence exceeds 5.86 J/cm2.
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Key words:
- bipolar transistor /
- damage effect /
- pulse width /
- fluence /
- burnout point
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