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封装结构强电磁脉冲多物理效应并行计算程序研制

赵振国 李光荣 童杰 徐刚 周海京

赵振国, 李光荣, 童杰, 等. 封装结构强电磁脉冲多物理效应并行计算程序研制[J]. 强激光与粒子束, 2018, 30: 083001. doi: 10.11884/HPLPB201830.170429
引用本文: 赵振国, 李光荣, 童杰, 等. 封装结构强电磁脉冲多物理效应并行计算程序研制[J]. 强激光与粒子束, 2018, 30: 083001. doi: 10.11884/HPLPB201830.170429
Zhao Zhenguo, Li Guangrong, Tong Jie, et al. Development of massively parallel simulation software applied to multi-physics effect with electromagnetic pluses excitation[J]. High Power Laser and Particle Beams, 2018, 30: 083001. doi: 10.11884/HPLPB201830.170429
Citation: Zhao Zhenguo, Li Guangrong, Tong Jie, et al. Development of massively parallel simulation software applied to multi-physics effect with electromagnetic pluses excitation[J]. High Power Laser and Particle Beams, 2018, 30: 083001. doi: 10.11884/HPLPB201830.170429

封装结构强电磁脉冲多物理效应并行计算程序研制

doi: 10.11884/HPLPB201830.170429
基金项目: 

国家自然科学基金项目 11675022

国家自然科学基金项目 6143104

科学挑战专题资助项目 TZ2018002

;中物院复杂电磁环境重点实验室基金项目 FZ2018-001

详细信息
    作者简介:

    赵振国(1987―),男,助理研究员,主要从事电路、半导体器件、系统级封装高性能数值模拟研究;346788393@qq.com

  • 中图分类号: TN385;T974

Development of massively parallel simulation software applied to multi-physics effect with electromagnetic pluses excitation

  • 摘要: 介绍了自主研发的强电磁脉冲多物理效应并行计算程序JEMS-CDS-System的情况,该程序采用时域有限元方法,基于JAUMIN并行自适应结构网格支撑框架研制,并行效能高,可扩展性强,且支持动态负载平衡。通过算例测试表明,该程序对于键合线的电-热-应力失效过程的最高温度与范式等效应力计算结果与COMSOL软件计算结果吻合较好;SiP功率放大模块的热-应力耦合天河2高性能计算平台并行计算结果表明,该程序在CPU1024核时,具有38.1%并行效率。
  • 图  1  网格层次结构

    Figure  1.  Hierarchical structure of patches

    图  2  JAUMIN并行计算层次结构

    Figure  2.  Hierarchical structure of JAUMIN

    图  3  LDMOSFET的输入输出键合线的几何结构尺寸与模型

    Figure  3.  Photo and geometry of LDMOSFET with input and output bonding wire arrays

    图  4  JEMS-CDS-System软件计算键合线温度分布图与形变计算结果

    Figure  4.  Distribution of temperature and displacement with JEMS-CDS-System

    图  5  JEMS-CDS-System软件最高温度、最大应力计算结果与商业软件COMSOL计算结果对比

    Figure  5.  Comparison between JEMS-CDS-System software and COMSOL results of maximum temperature and maximum stress

    图  6  SiP结构模型与并行计算进程划分

    Figure  6.  SiP structure model and parallel computing process division

    图  7  基于JEMS-CDS-System的温度分布与范式等效应力分布计算结果

    Figure  7.  Distribution of temperature and distribution of von Mises stress with JEMS-CDS-System

    表  1  验证性并行计算相关参数

    Table  1.   Parallel scalability of the proposed simulation

    number of CPU cores time of one step/s speedup efficiency/%
    64 1035.0 100
    128 718.2 1.265× 72.1
    256 486.4 2.128× 53.2
    512 259.9 3.982× 49.8
    1024 169.8 6.095× 38.1
    下载: 导出CSV
  • [1] Lu Tianjian, Jin Jianming. Coupled electrical-thermal-mechanical simulation for the reliability analysis of large-scale 3-D interconnects[J]. IEEE Transactions on Components Packaging & Manufacturing Technology, 2017, 7(2): 229-237.
    [2] 赵振国, 周海京, 马弘舸, 等. PIN限幅器电磁脉冲效应数值模拟与验证[J]. 强激光与粒子束, 2014, 26: 063018. doi: 10.11884/HPLPB201426.063018

    Zhao Zhenguo, Zhou Haijing, Ma Hongge, et al. Numerical simulation and verification of electromagnetic pulse effect of PIN diode limiter. High Power Laser and Particle Beams, 2014, 26: 063018 doi: 10.11884/HPLPB201426.063018
    [3] Tong Jie, Zhu Guodong, Hu Jun, et al. Study on electro-thermo-mechanical responses of bonding wires arrays used for the package design of LDMOSFET-based RF amplifier[C]//IEEE Electrical Design of Advanced Packaging and Systems. 2017: 211-213.
    [4] Zhou Wei, Zhou Liang, Lin Liang, et al. Electro-thermal-stress interactions of LDMOS FET induced by DCI RF-pulses[J]. IEEE Transactions on Electromagnetic Compatibility, 2014, 56(5): 1178-1184. doi: 10.1109/TEMC.2014.2314304
    [5] Sandia National Laboratories. Engineering Physics Integrated Codes[EB/OL]. http://www.sandia.gov/asc/integrated_codes.html
    [6] Liu Qingkai, Zhao Weibo, Cheng Jie, et al. A programming framework for large scale numerical simulations on unstructured mesh[C]// Proceedings of the 2nd IEEE International Conference on High Performance and Smart Computing (IEEE HPSC). 2016.
    [7] Tong Jie, Zhu Guodong, Hu Jun, et al. Study on electro-thermo-mechanical responses of bonding wires arrays used for the package design of LDMOSFET-based RF amplifier[C]//IEEE Electrical Design of Advanced Packaging and Systems. 2017: 211-213.
    [8] Kong Fanzhi, Yin Wenyan, Mao Junfa, et al. Electro-thermo-mechanical characterizations of various wire bonding interconnects illuminated by an electromagnetic pulse[J]. IEEE Transactions on Advanced Packaging, 2010, 33(3): 729-737. doi: 10.1109/TADVP.2010.2048902
    [9] 林良. 高性能射频半导体功率器件设计及其在无线通信中的应用研究[D]. 上海: 上海交通大学, 2016.

    Lin Liang. Design of high performance RF semiconductor power device and its application in wireless communication. Shanghai: Shanghai Jiaotong University, 2016
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出版历程
  • 收稿日期:  2017-11-02
  • 修回日期:  2018-04-17
  • 刊出日期:  2018-08-15

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