太赫兹金属器件电铸工艺中电流密度研究

赵欣悦; 姬生伟; 卢怡如; 刘玉宝; 黄波; 王小康

doi:10.11884/HPLPB201931.190067

太赫兹金属器件电铸工艺中电流密度研究

doi: 10.11884/HPLPB201931.190067

赵欣悦^{1, 2,},
姬生伟^{1, 2},
卢怡如³,
刘玉宝^{1, 4},
黄波^{1, 2},
王小康^{1, 2}

1.
合肥工业大学光电技术研究院, 合肥 230009
2.
合肥工业大学仪器科学与光电工程学院, 合肥 230009
3.
中航光电科技股份有限公司, 河南洛阳 471000
4.
合肥工业大学电子科学与应用物理学院, 合肥 230009

基金项目:

国家自然科学基金项目 61501166

详细信息

作者简介:
赵欣悦(1994-), 女, 硕士研究生, 从事太赫兹器件的设计及加工研究, zhaoxinyue@mail.hfut.edu.cn

中图分类号: TQ153.4
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- 被引次数: 0
出版历程
- 收稿日期: 2019-03-08
- 修回日期: 2019-04-21
- 刊出日期: 2019-08-15

Study of current density distribution in terahertz device micro-electroforming process

Zhao Xinyue^{1, 2
,},
Ji Shengwei^{1, 2},
Lu Yiru³,
Liu Yubao^{1, 4},
Huang Bo^{1, 2},
Wang Xiaokang^{1, 2}

1.
Academy of Photoelectric Technology, Hefei University of Technology, Hefei 230009, China
2.
School of Instrument Science and Opto-electronics Engineering, Hefei University of Technology, Hefei 230009, China
3.
AVIC Photoelectric Technology Co, Ltd, Luoyang 471000, China
4.
School of Electronic Science and Applied Physics, Hefei University of Technology, Hefei 230009, China

摘要

摘要: 微电铸工艺是太赫兹全金属光栅器件成型的关键工序。金属光栅质量取决于电铸工艺中金属离子沉积的均匀性, 而电铸槽阴极附近电流密度的分布直接影响金属离子沉积的均匀性。在阳极与阴极间添加开孔的绝缘玻璃挡板可以改善阴极电流密度分布的均匀性, 研究了挡板与阴极的距离以及挡板开孔大小对阴极电流密度分布的影响, 仿真结果表明: 添加开孔绝缘挡板有助于改善阴极处的电流密度分布; 当添加的玻璃挡板开孔大小与阴极尺寸一致时, 挡板距离阴极越近, 阴极的电流密度分布越均匀。根据仿真结果设计了相应的挡板, 电铸工艺获得了较好质量的均匀金属层, 从而验证了上述仿真分析的有效性。
- 微电铸 /
- 太赫兹 /
- 挡板 /
- 电流密度
Abstract: Micro-electroforming is a key step of terahertz all-metal devices microfabrication, in which metal-ion deposit uniformity determines the grating's quality.Meanwhile, the deposit uniformity is influenced by the distribution of current density near the cathode.The current density distribution in copper micro-electroforming is investigated by method of FIT (finite integration technique) simulation analysis and experimental verification.By adding aglass baffle panel between anode and cathode, the current density uniformity can be improved.The effect of the distance between panel and cathode and the size of hole in baffle panel on current density uniformity is analyzed thoroughly.The nearer the panel is to the cathode, the more uniform the current density of the cathode, which can significantly improve the uniformity of deposit in microstructure.According to the simulation results, a baffle panel with a 2.5 cm×2.5 cm gap is fabricated and placed between the anode and the cathode with a 100 mm distance from the cathode.Then electroforming was carried out and a better quality metal layer with finer and more uniform grain was gained, which proved the simulation results.
- micro-electroforming /
- terahertz /
- baffle panel /
- current density

HTML全文

图 1 微电铸模型

Figure 1. Micro-electroforming model

下载: 全尺寸图片幻灯片

图 2 未使用玻璃挡板时阴极表面的电流密度分布

Figure 2. Current density distribution on the cathode surface without baffle panel

下载: 全尺寸图片幻灯片

图 3 使用玻璃挡板时阴极表面的电流密度分布

Figure 3. Current density distribution on the cathode surface with baffle panel

下载: 全尺寸图片幻灯片

图 4 挡板与阴极不同距离处阴极的电流密度分布

Figure 4. Current density distribution of the cathode at different distance between the baffle panel and the cathode

下载: 全尺寸图片幻灯片

图 5 不同开孔的玻璃挡板下阴极处电流密度分布

Figure 5. Current density distribution at the cathode with different hole in the baffle panel

下载: 全尺寸图片幻灯片

图 6 有无挡板时获得的电铸金属层的表面形貌

Figure 6. Surface profile of electroformed metal layer

下载: 全尺寸图片幻灯片

表 1 各材料的电导率

Table 1. Conductivity of each material in the system of electroforming

material	conductivity/(S·m^-1)
copper	5.8×10⁷
electroforming solution	170
SU-8 resist	10^-14
baffle panel	10^-14

下载: 导出CSV

参考文献(13)

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