大于500 W非水冷光纤包层光剥离器

刘玙; 李敏; 黄珊; 吴文杰; 冯曦; 沈本剑; 宋华青; 陶汝茂; 王建军; 景峰

doi:10.11884/HPLPB202133.200182

大于500 W非水冷光纤包层光剥离器

doi: 10.11884/HPLPB202133.200182

中国工程物理研究院激光聚变研究中心，四川绵阳 621900

基金项目: 国家自然科学基金项目（61905226，61805222）；国家重点研发计划项目（2017YFB1104401）

详细信息

作者简介:
刘　玙（1987—），女，博士，助理研究员，从事光纤激光器件研究；liuyu_ly@foxmail.com

通讯作者:
陶汝茂（1987—），男，博士，副研究员，从事光纤激光技术研究；taorumao@sohu.com

中图分类号: TN248
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- 被引次数: 0
出版历程
- 收稿日期: 2020-06-30
- 修回日期: 2020-11-03
- 刊出日期: 2021-01-07

＞500 W passively-cooled fiber cladding light stripper

Laser Fusion Research Center, CAEP, P. O. Box 919-988, Mianyang 621900, China

摘要

摘要: 为实现高功率光纤包层光剥离器被动冷却，需要同时对光纤和封装壳体进行有效热管理。采用一种基于铁氟龙毛细管分段化学腐蚀光纤的制备技术，使用紫铜作为壳体材料，并通过有限元分析算法对壳体温度场进行仿真计算，对壳体各个结构参量进行优化分析，设计了满足500 W散热能力的包层光剥离器，并开展了实验验证。研究结果表明，采用铁氟龙管分段腐蚀法，包层光剥离比达到23.7 dB，光纤裸纤上的功率温升速率仅0.007 ℃/W。采用优化设计的壳体，在540 W功率注入下，包层光剥离器使用水冷冷板冷却可以连续出光，壳体最高温度58.7 ℃，使用相变冷板冷却可以单次安全出光50 s，壳体最高温度80 ℃。此研究结果可以为高功率光纤激光设计与研发提供重要参考。
- 包层光剥离器 /
- 模式剥除 /
- 光纤激光 /
- 光纤器件 /
- 双包层光纤
Abstract: To realize of passive-cooling high power fiber cladding light stripper, it is important to optimize the thermal management of both the fiber and the package. By using Teflon capillaries to make segmental etching configuration on fiber, using copper as the package material, and optimizing the package structure through finite element thermal simulations, cladding light stripper capable of handling 500 W power was designed and fabricated. It was experimentally verified that the stripping efficiency reached 23.7 dB and the temperature increase rate on the bare fiber of cladding light stripper was as low as 0.007 ℃/W. In addition, at 540 W of power injection, cladding light stripper could work continuously if mounted on water-cooled cold plate, and could work for 50 s each time if mounted on cold plate filled with phase-change material, with the maximum temperature of package being 58.7 ℃ and 80 ℃ respectively. The researches and results could provide valuable information to the design and development of high power fiber lasers.
- cladding light stripper /
- mode stripper /
- fiber laser /
- optical fiber device /
- double cladding fiber

HTML全文

图 1 CPS壳体结构建模和热仿真结果示例

Figure 1. Modeling and thermal simulation of packaged CPS

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图 2 CPS壳体结构参数对CPS封装件最高温度的影响，假定注入功率为500 W

Figure 2. Impact of structural parameters on maximum temperature of packaged CPS, assuming 500 W of power injection

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图 3 CPS功率和温度测试光路图

Figure 3. Experimental setup for testing the power stripping and temperature rise behaviors of CPS

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图 4 CPS毛化区温升曲线

Figure 4. Temperature rise curve of CPS micro-structured area

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图 5 CPS封装件安装于水冷冷板测试结果

Figure 5. Test results of packaged CPS mounted on water-cooled cold plate

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图 6 CPS封装件安装于相变蓄冷板测试结果

Figure 6. Test results of packaged CPS mounted on cold plate filled with phase-change material

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