Two-stage microstructure on surface of vacuum polymer insulators
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摘要: 为研究绝缘子表面二级微结构的耐压提升机制,将表面二级微结构拆分为两种子结构,也即是表面微孔结构与表面微槽结构,并通过复合材料制备、激光处理、酸液选择性腐蚀等方式制备出表面二级微结构与相应的两种子结构。对三种结构分别进行沿面耐压性能测试,结果表明表面微孔与表面微槽均能有效地提升绝缘子的真空沿面耐压性能,而二者组合形成的表面二级微结构能够进一步提升绝缘子的真空沿面耐压性能。该结果表明通过将表面结构进行合理的组合能够实现对绝缘子表面闪络发展的多重、协同抑制,进一步提升绝缘子的真空沿面耐压水平。Abstract: In a previous work, a two-stage microstructure was proposed and demonstrated to be able to sharply improve surface flashover voltage of polymer insulators in vacuum. In this paper, the two-stage microstructure was separated into two sub-structures, i.e., surface micro-groove structure and surface micro-hole structure, to study the voltage improvement mechanism in the two-stage microstructure. Through the synthesis of a composite material, laser treatment and acid corrosion, the two-stage microstructure was prepared as well as the two sub-structures. Flashover test of the insulators with the three kinds of surface structures showed that construction of micro grooves and micro holes on the surface of insulators could both enhance the surface flashover strength and their combination could further enhance the flashover strength. The results indicate that through proper combination of different kinds of surface structures multiple suppression of the flashover could be achieved and the surface flashover voltage could be further improved.
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表 1 三种表面微结构参数表
Table 1. List of the parameters of the three kinds of microstructures
two-stage microstructure surface micro groove surface micro hole group 1 depth 200 μm, 12 lines/5 mm, 5.5 μm 4% depth 200 μm, 12 lines/5 mm 5.5 μm 4% group 2 depth 200 μm, 12 lines/5 mm, 2.5 μm 6% depth 200 μm, 12 lines/5 mm 2.5 μm 6% group 3 depth 200 μm, 15 lines/5 mm, 5.5 μm 4% depth 200 μm, 15 lines/5 mm 5.5 μm 4% group 4 depth 200 μm, 15 lines/5 mm, 2.5 μm 6% depth 200 μm, 15 lines/5 mm 2.5 μm 6% -
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