连续100 W量子阱二极管激光器封装工艺
Packaging technique of CW 100 W quantum-well diode laser
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摘要: 为了提高激光器输出功率,对研制的铜微通道冷却器性能进行了测试,分析了其散热能力。设计了一种在软焊料中掺杂金属添加剂的工艺,有效抑制了晶须生长,并利用该冷却器和新工艺封装出了连续100 W大功率二极管激光器,并对封装的器件进行了性能测试。测试结果表明,封装的连续100 W器件在工作电流105 A时,输出功率超过了100 W,中心波长为808.5 nm,光谱半高宽为2.15 nm,器件的smile尺寸小于2 μm,部分值小于0.5 μm。Abstract: In order to increase out power of DL, the copper micro-channel cooler’s property was tested, and its ability to dissipate heat was analyzed. An indium alloy solder was developed, which can dispel crystal beard. The CW 100 W high power laser diode was packaged directly on the cooler with new technique and tested. The results of measurement show that the CW 100 W laser diode output power more than 100 W at drive current of 105 A, the central wavelengh is 808.5 nm and the FWHM is 2.15 nm. The smile effect of the packaged diode bars is usually less than 2 μm, for some samples, it is even less than 0.5 μm.
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Key words:
- diode laser /
- packaging /
- smile effect /
- micro-channel cooling /
- solder
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