Guo Honglei, Liu Jingquan, Chen Xiang, et al. Selective removal of parylene-C film by ultrafine Ar/O2 atmospheric pressure plasma jet[J]. High Power Laser and Particle Beams, 2015, 27: 024114. doi: 10.11884/HPLPB201527.024114
Citation:
Guo Honglei, Liu Jingquan, Chen Xiang, et al. Selective removal of parylene-C film by ultrafine Ar/O2 atmospheric pressure plasma jet[J]. High Power Laser and Particle Beams, 2015, 27: 024114. doi: 10.11884/HPLPB201527.024114
Guo Honglei, Liu Jingquan, Chen Xiang, et al. Selective removal of parylene-C film by ultrafine Ar/O2 atmospheric pressure plasma jet[J]. High Power Laser and Particle Beams, 2015, 27: 024114. doi: 10.11884/HPLPB201527.024114
Citation:
Guo Honglei, Liu Jingquan, Chen Xiang, et al. Selective removal of parylene-C film by ultrafine Ar/O2 atmospheric pressure plasma jet[J]. High Power Laser and Particle Beams, 2015, 27: 024114. doi: 10.11884/HPLPB201527.024114
A special microneedle is employed to prepare an ultrafine Ar/O2 atmospheric pressure plasma jet source device. When a high voltage of 4.0 kV is applied to the electrodes, this device can generate stable and almost homogeneous plasma jet, and its line width is on the order of tens of micrometers.Additionally, the ability of ultrafine Ar/O2 plasma jet to selectively remove parylene-C film is also investigated. Experimental results indicate that this ultrafine Ar/O2 plasma jet can effectively remove parylene-C film and the removal rate reaches 2.4 m/min. Therefore, this Ar/O2 atmospheric pressure plasma jet have the potential of being used to the ultrafine process for future material processing.
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