Design of electroplating device for double-shell targets

A device is designed to deposit metals on double-shell targets. The plating mechanism is described in detail, as well as structure and function. The special structure of the tank make the growing speed of upper surface faster than that of the lower. Rotation and revolution of the micro spheres make the deposit grow uniformly. The special flow pattern of plating bath reduces the number of parameters, and make the process easy to control. Determinants of layer thickness and uniformity were researched. The results show that the new plating tank has a better performance than the old one. Layer thickness is determined by depositing time, metal density, solution density, equivalent density of the micro spheres.