Lu Yiru, Zhang Chen, Ruan Jiufu, et al. Internal stress of photoresists for microfabrication of THz full-metal grating[J]. High Power Laser and Particle Beams, 2015, 27: 113101. doi: 10.11884/HPLPB201527.113101
Citation:
Lu Yiru, Zhang Chen, Ruan Jiufu, et al. Internal stress of photoresists for microfabrication of THz full-metal grating[J]. High Power Laser and Particle Beams, 2015, 27: 113101. doi: 10.11884/HPLPB201527.113101
Lu Yiru, Zhang Chen, Ruan Jiufu, et al. Internal stress of photoresists for microfabrication of THz full-metal grating[J]. High Power Laser and Particle Beams, 2015, 27: 113101. doi: 10.11884/HPLPB201527.113101
Citation:
Lu Yiru, Zhang Chen, Ruan Jiufu, et al. Internal stress of photoresists for microfabrication of THz full-metal grating[J]. High Power Laser and Particle Beams, 2015, 27: 113101. doi: 10.11884/HPLPB201527.113101
A three-dimensional finite element analysis (FEA) model is constructed and the influences of some parameters such as the film thickness, post-exposure-bake (PEB) temperature, cooling rate on the stress are numerically investigated employing thermal-structural coupling analysis based on the model. The simulation results shows that cooling rate has much more influence on the stress than the film thickness and PEB temperature and the stress is inversely proportional to the cooling rate. And the stress drops slightly when the cooling rate is lower than 6 ℃/h. The optimization experiment is carried out according to the simulation results and the phenomenon concerning the stress disappears, which proves the validity of the simulation method and results.
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