Internal stress of photoresists for microfabrication of THz full-metal grating

Lu Yiru; Zhang Chen; Ruan Jiufu; Yang Jun; Deng Guangsheng; Lv Guoqiang

doi:10.11884/HPLPB201527.113101

Volume 27 Issue 11

Nov. 2015

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Article Navigation > High Power Laser and Particle Beams > 2015 > 27(11): 113101

Hao Yong, Li Yongdong, Ding Zhenjie, et al. Pre-pulse mechanism and effects of parameters in semiconductor opening switches[J]. High Power Laser and Particle Beams, 2018, 30: 065001. doi: 10.11884/HPLPB201830.170516

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Lu Yiru, Zhang Chen, Ruan Jiufu, et al. Internal stress of photoresists for microfabrication of THz full-metal grating[J]. High Power Laser and Particle Beams, 2015, 27: 113101. doi: 10.11884/HPLPB201527.113101

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Internal stress of photoresists for microfabrication of THz full-metal grating

doi: 10.11884/HPLPB201527.113101

Lu Yiru^1,2,3,
Zhang Chen^1,2,
Ruan Jiufu^{1,2
,
,},
Yang Jun^1,2,
Deng Guangsheng^1,2,
Lv Guoqiang^1,2

1.
Key Laboratory of Special Display Technology of Ministry of Education,Hefei University of Technology,Hefei 230009,China;
2.
Academy of Photoelectric Technology,Hefei University of Technology,Hefei 230009,China;
3.
School of Instrument Science and Opto-electronic Engineering,Hefei University of Technology,Hefei 230009,China

Received Date: 2015-06-08
Rev Recd Date: 2015-07-16
Publish Date: 2015-10-27

Abstract

Abstract

A three-dimensional finite element analysis (FEA) model is constructed and the influences of some parameters such as the film thickness, post-exposure-bake (PEB) temperature, cooling rate on the stress are numerically investigated employing thermal-structural coupling analysis based on the model. The simulation results shows that cooling rate has much more influence on the stress than the film thickness and PEB temperature and the stress is inversely proportional to the cooling rate. And the stress drops slightly when the cooling rate is lower than 6 ℃/h. The optimization experiment is carried out according to the simulation results and the phenomenon concerning the stress disappears, which proves the validity of the simulation method and results.
- full-metal grating,
- photolithography,
- finite element analysis,
- internal stress,
- viscoelasticity

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