Shen Zicai, Tong Xin, Wu Bohan. Mechanical property evolution mechanism of polyimide film under electron irradiation[J]. High Power Laser and Particle Beams, 2016, 28: 059001. doi: 10.11884/HPLPB201628.059001
Citation:
Shen Zicai, Tong Xin, Wu Bohan. Mechanical property evolution mechanism of polyimide film under electron irradiation[J]. High Power Laser and Particle Beams, 2016, 28: 059001. doi: 10.11884/HPLPB201628.059001
Shen Zicai, Tong Xin, Wu Bohan. Mechanical property evolution mechanism of polyimide film under electron irradiation[J]. High Power Laser and Particle Beams, 2016, 28: 059001. doi: 10.11884/HPLPB201628.059001
Citation:
Shen Zicai, Tong Xin, Wu Bohan. Mechanical property evolution mechanism of polyimide film under electron irradiation[J]. High Power Laser and Particle Beams, 2016, 28: 059001. doi: 10.11884/HPLPB201628.059001
The electron irradiation ground simulation test was conducted on the mechanical property of polyimide film, thermo gravimetric and X-ray Photoelectron Spectroscopy was used to analyze the evolution mechanism of polyimide film in different electron fluencies. It was found that the mechanical properties such as tensile force, tensile strength and rupture elongation of polyimide film increased firstly and then exponentially decreased. The corresponding initial decomposition temperature of the electron-radiated polyimide film lowered from 595 ℃ to 583 ℃ for weight-loss ratio of 10%. From XPS analysis, it can be found that there were ruptures and crosslinks of chemical bonds in the polyimide film. In early stage of electron irradiation, the rupture of CN bond and the following crosslink increased the mechanical properties of polyimide film; however, along with the increase of electron irradiation, the ruptures of C=O and N(CO)bonds, formation of CN bond, as well as release of N were the main factors for the decrease of mechanical properties of polyimide films.