Volume 28 Issue 06
May  2016
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Article Navigation >  High Power Laser and Particle Beams  > 2016  >  28(06): 064111
Liu Shenggang, Tao Tianjiong, Ma Heli, et al. Method of big step height measurements based on white light frequency domain interferometry[J]. High Power Laser and Particle Beams, 2015, 27: 091007. doi: 10.11884/HPLPB201527.091007
Citation: Du Liqun, Yang Tong, Zhao Ming, et al. Improvement of microfluidic chip mould thickness uniformity by ultrasonic agitation during electroforming process[J]. High Power Laser and Particle Beams, 2016, 28: 064111. doi: 10.11884/HPLPB201628.064111
shu

Improvement of microfluidic chip mould thickness uniformity by ultrasonic agitation during electroforming process

doi: 10.11884/HPLPB201628.064111
  • 1.

    Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education,Dalian University of Technology,Dalian 116024,China;

  • 2.

    Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian 116024,China;

  • 3.

    Capitalbio,Beijing 101111,China

  • Received Date: 2015-11-13
  • Rev Recd Date: 2015-12-18
  • Publish Date: 2016-06-15
    Abstract
  • The electroforming microfluidic chip mould faces the problem of uneven thickness,which influences the dimensional accuracy and performance of the mould, and increases the production cost. With the aim of fabricating a microfluidic chip mould with uniform thickness, electroforming with ultrasonic agitation is investigated to improve the thickness uniformity of the mould. Firstly, numerical simulation is performed using COMSOL multiphysics software to analyze the thickness distribution of the mould after 2 h electroforming. And based on the simulation result, a photomask is designed. Secondly, with the photomask, electroforming experiments are carried out to study how ultrasonic agitation affects the thickness uniformity of the mould. It is found that the ultrasonic agitation can improve the thickness uniformity of the mould. With 200 W ultrasonic agitation, the effect of ultrasonic frequency on the thickness uniformity increases in the order of 200 kHz＞80 kHz＞120 kHz. And with 200 kHz ultrasonic agitation, the effect of ultrasonic power on the thickness uniformity increases in the order of 500 W＞200 W＞100 W. Compared with the thickness uniformity without ultrasonic agitation, with 200 kHz and 500 W ultrasonic agitation, the thickness uniformity of the mould is increased by about 30%.
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