Zhang Yongzhan, Meng Fanbao, Zhao Gang. Influence of Ⅰ layer thickness on thermal damage process of PIN limiter[J]. High Power Laser and Particle Beams, 2017, 29: 093002. doi: 10.11884/HPLPB201729.170087
Citation:
Zhang Yongzhan, Meng Fanbao, Zhao Gang. Influence of Ⅰ layer thickness on thermal damage process of PIN limiter[J]. High Power Laser and Particle Beams, 2017, 29: 093002. doi: 10.11884/HPLPB201729.170087
Zhang Yongzhan, Meng Fanbao, Zhao Gang. Influence of Ⅰ layer thickness on thermal damage process of PIN limiter[J]. High Power Laser and Particle Beams, 2017, 29: 093002. doi: 10.11884/HPLPB201729.170087
Citation:
Zhang Yongzhan, Meng Fanbao, Zhao Gang. Influence of Ⅰ layer thickness on thermal damage process of PIN limiter[J]. High Power Laser and Particle Beams, 2017, 29: 093002. doi: 10.11884/HPLPB201729.170087
Based on the device physics simulation, we studied the microwave pulse thermal process of the PIN limiter diode, and the devices 2D multi-physical field model was established with software Sentaurus-TCAD. The peak temperature change of different thickness of Ⅰ layer was analyzed under injections of 5.3,7.5 and 9.4 GHz microwave signals. Simulation results show that the influence of Ⅰ layer thickness on thermal process of PIN diode divides into two stages, before the turning point, the peak temperature changes with the increasing of Ⅰ layer thickness, after the point the peak temperature decreases with the increasing of Ⅰ layer thickness. The influence of microwave pulse frequency on the turning point is not obvious.