Design of new power source for plasma magnetron sputtering coating

Li Bo; Zhao Juan; Li Hongtao; Ye Chao; Tan Weiwei; Huang Bin; Lu Xiangyang; Huang Yupeng; Zhang Xin; Ouyang Yanjing; Kang Chuanhui; Qi Zhuoyun

doi:10.11884/HPLPB201931.190002

Volume 31 Issue 4

Apr. 2019

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Article Navigation > High Power Laser and Particle Beams > 2019 > 31(4): 040020

Li Bo, Zhao Juan, Li Hongtao, et al. Design of new power source for plasma magnetron sputtering coating[J]. High Power Laser and Particle Beams, 2019, 31: 040020. doi: 10.11884/HPLPB201931.190002

Citation:

Li Bo, Zhao Juan, Li Hongtao, et al. Design of new power source for plasma magnetron sputtering coating[J]. High Power Laser and Particle Beams, 2019, 31: 040020. doi: 10.11884/HPLPB201931.190002

Li Bo, Zhao Juan, Li Hongtao, et al. Design of new power source for plasma magnetron sputtering coating[J]. High Power Laser and Particle Beams, 2019, 31: 040020. doi: 10.11884/HPLPB201931.190002

Citation:

Li Bo, Zhao Juan, Li Hongtao, et al. Design of new power source for plasma magnetron sputtering coating[J]. High Power Laser and Particle Beams, 2019, 31: 040020. doi: 10.11884/HPLPB201931.190002

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Design of new power source for plasma magnetron sputtering coating

doi: 10.11884/HPLPB201931.190002

1.
Key Laboratory of Pulsed Power, Institute of Fluid Physics, CAEP, P. O. Box 919-805, Mianyang 621900, China
2.
School of Physics, Peking University, Beijing 100871, China

Received Date: 2019-01-02
Rev Recd Date: 2019-02-25
Publish Date: 2019-04-15

Abstract

Abstract

Power source of magnetron sputtering coating is one of the key equipment in magnetron sputtering system. A power supply of magnetron sputtering with adjustable output voltage of 0-800 V, pulse width of 5-200 μs, frequency of 0-60 Hz and maximum pulse current of 150 A is developed according to the technical parameters of the sputtering treatment equipment for niobium and tin targets. The experimental results of the prepared power supply with the niobium target load and tin target load are given respectively. To solve the problems of unsuccessful sputtering of particles, inconsistent ionization time, poisoning of target surface and low sputtering efficiency in high power magnetron sputtering under repetitive frequency operation, a high power bipolar pulse forming circuit integrated with high voltage short pulse preionization is adopted. The gas pressure can realize sputtering coating with low pressure. This design has improved the sputtering efficiency of the target and reduced the surface roughness of the film. The results of experiments show that the prepared power supply achieves the ideal sputtering effect and meets the requirements of the index.
- high voltage preionization,
- bipolar pulse,
- low pressure sputtering,
- plasma

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References(14)

References

[1]	李春伟, 苗红涛, 徐淑艳, 等. 复合高功率脉冲磁控溅射技术的研究进展[J]. 表面技术, 2016, 45(6): 82-88. https://www.cnki.com.cn/Article/CJFDTOTAL-BMJS201606013.htm Li Chunwei, Miao Hongtao, Xu Shuyan, et al. Research progress of hybrid high power impulse magnetron sputtering. Surface Technology, 2016, 45(6): 82-88 https://www.cnki.com.cn/Article/CJFDTOTAL-BMJS201606013.htm
[2]	Kubinski I J A, Hurkmans T, Trinh T, et al. Perspective for replacement of hard chromium by PVD[J]. Plat Surf Finish, 1999, 86: 20-25.
[3]	Konyashin I Y. PVD/CVD technology for coating cemented carbides[J]. Surface and Coatings Technology, 1995, 71: 277-283. doi: 10.1016/0257-8972(94)02325-K
[4]	Zhao Guojun, Lin Bin, Jiang Bailing, et al. Microstructure and mechanical properties of multilayer Ti(C, N) films by closed-field unbalanced magnetron sputtering ion plating[J]. Journal of Materials Science & Technology, 2010, 26(2): 119-124
[5]	张继成, 吴卫东, 许华, 等. 磁控溅射技术新进展及应用[J]. 材料导报, 2004, 18(4): 56-59. https://www.cnki.com.cn/Article/CJFDTOTAL-CLDB200404016.htm Zhang Jicheng, Wu Weidong, Xu Hua, et al. The recent developments and applications of magnetron sputtering. Material Review, 2004, 18(4): 56-59 https://www.cnki.com.cn/Article/CJFDTOTAL-CLDB200404016.htm
[6]	田民波. 薄膜科学与技术手册[M]. 北京: 机械工业出版社, 1991, 2-5. Tian Minbo. Handbook of membrane science and technology. Beijing: China Machine Press, 1991: 2-5
[7]	Munz W D. Properties of niobium-based wear and corrosion resistant hard PVD coating deposition on various steels[J]. Metal Ital, 2002, 94(11): 25-27.
[8]	田修波, 吴忠振, 石经纬, 等. 高脉冲功率密度复合磁控溅射电源研制及放电特性研究[J]. 真空, 2010, 47(3): 44-47. https://www.cnki.com.cn/Article/CJFDTOTAL-ZKZK201003017.htm Tian Xiubo, Wu Zhongzhen, Shi Jingwei, et al. Development and discharge behavior of high power density pulse magnetron sputtering system. Vacuum, 2010, 47(3): 44-47 https://www.cnki.com.cn/Article/CJFDTOTAL-ZKZK201003017.htm
[9]	Helmerssonl J, Lattemann M, Bohlmark J, et al. Ionized physical vapor deposition (IPVD): A review of technology and applications[J]. Thin Solids Films, 2006, 513(1/2): 1-24.
[10]	Boo J M, Jung M J, Park H K. High-rate deposition of copper thin films using newly designed high-power magnetron sputtering source[J]. Surface and Coatings Technology, 2004, 721-727.
[11]	戴茂飞. 脉冲调制射频磁控溅射电源的研制[D]. 武汉: 中南民族大学, 2012. Dai Maofei. The research on pulse modulation RF power supply for magnetron sputtering. Wuhan: South-central University for Nationalities, 2012
[12]	李波, 李博婷, 黄斌, 等. 高可靠性脉冲氙灯电源设计[J]. 强激光与粒子束, 2017, 29(6): 065004. doi: 10.11884/HPLPB201729.160468 Li Bo, Li Boting, Huang Bin, et al. Design of high reliability pulse xenon lamp power supply. High Power Laser and Particle Beams, 2017, 29(6): 065004 doi: 10.11884/HPLPB201729.160468
[13]	赵娟, 曹科峰, 曹宁翔, 等. 脉冲氙灯放电闪光仪[J]. 仪器仪表学报, 2009, 28(6): 52-53, 58. https://cpfd.cnki.com.cn/Article/CPFDTOTAL-YQYB200808003199.htm Zhao Juan, Cao Kefeng, Cao Ningxiang, et al. A strobo of pulse xenon lamp discharge. Chinese Journal of Scientific Instrument, 2009, 28(6): 52-53, 58 https://cpfd.cnki.com.cn/Article/CPFDTOTAL-YQYB200808003199.htm
[14]	李波, 李博婷, 叶超, 等. 双极性脉冲磁控溅射电源设计[J]. 强激光与粒子束, 2018, 30: 045004. doi: 10.11884/HPLPB201830.170393 Li Bo, Li Boting, Ye Chao, et al. Design of bipolar pulsed magnetron sputtering power supply. High Power Laser and Particle Beams, 2018, 30: 045004 doi: 10.11884/HPLPB201830.170393