Citation: | Chen Qiang, Xu Ke, Chen Zhenzhen, et al. System-level electrostatic discharge simulation based on transmission line pulse modeling[J]. High Power Laser and Particle Beams, 2019, 31: 103208. doi: 10.11884/HPLPB201931.190113 |
[1] |
Jiang X, Shi Q, Gao Y. Integrated circuit ESD protection structure failure analysis based on TLP technique[C]//International Conference on Electronic Packaging Technology IEEE. 2016.
|
[2] |
Honda M. A review of EMI problem caused by ESD phenomena[C]//13th RCJ Reliability Symposium. 2003: 183-186.
|
[3] |
Yoshida T, Masui N. A study on system-level ESD stress simulation using circuit simulator[C]// Proc of APEMC. 2013.
|
[4] |
Scholz M, Chen S, Vandersteen G. Comparison of system-level ESD design methodologies—Towards the efficient and ESD robust design of systems[J]. IEEE Trans Device Mater Rel, 2013, 13(1): 213-222. doi: 10.1109/TDMR.2012.2231414
|
[5] |
Robert M, Seol B, Chang N. System-level ESD failure diagnosis with chip-package-system dynamic ESD simulation[C]//Electrical Overstress/electrostatic Discharge Symposium IEEE. 2014.
|
[6] |
IEC61000-4-2, Electromagnetic compatibility (EMC)-Part 4-2: Testing and measurement techniques—Electrostatic discharge immunity test[S].
|
[7] |
Pommerenke D, Fan J, Drewniak J. Simulation challenges in system level electrostatic discharge modeling[C]//Proc 2016 IEEE/ACES Int Conf Wireless Inf Technol Syst Appl Comput Electromagn, 2016: 1-2.
|
[8] |
Yang S, Pommerenke D J. Effect of different load impedances on ESD generators and ESD generator SPICE models[J]. IEEE Trans Electromagnetic Compatibility, 2018, 60(6): 1726-1733.
|
[9] |
Jahanzeb A, Lou L, Duvvury C, et al. TLP characterization for testing system level ESD performance[C]//EOS/ESD Symp Proc. 2010.
|
[10] |
Scholz M, Linten D, Thijs S, et al. ESD on-wafer characterization: Is TLP still the right measurement tool[J]. IEEE Trans Instrumentation and Measurement, 2009, 58(10): 3418-3426. doi: 10.1109/TIM.2009.2017657
|
[11] |
Yoshida T. A study on transmission line modeling method for system-level ESD stress simulation[C]//Proc 2015 Asia-Pacific Symp Electromagn Compat. 2018: 577-580.
|