Volume 31 Issue 10
Oct.  2019
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Jin Wenxuan, Chai Changchun, Liu Yuqian, et al. Microwave damage susceptibilitytrend of the silicon NPN monolithic composite transistor as a function of structure parameters[J]. High Power Laser and Particle Beams, 2019, 31: 103220. doi: 10.11884/HPLPB201931.190218
Citation: Jin Wenxuan, Chai Changchun, Liu Yuqian, et al. Microwave damage susceptibilitytrend of the silicon NPN monolithic composite transistor as a function of structure parameters[J]. High Power Laser and Particle Beams, 2019, 31: 103220. doi: 10.11884/HPLPB201931.190218

Microwave damage susceptibilitytrend of the silicon NPN monolithic composite transistor as a function of structure parameters

doi: 10.11884/HPLPB201931.190218
Funds:

Open Fund of Key Laboratory of Complex Electromagnetic Environment Science and Technology, China Academy of Engineering Physics 2015-0214.XYK

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  • Author Bio:

    Jin Wenxuan(1995—), male, Master degree candidate, engaged in research of semiconductor devices and circuit reliability; wenxuan_jin@163.com

  • Corresponding author: Liu Yuqian(1993—), male, PhD, engaged in research of semiconductor devices and circuit reliability; yuqianliuxd@163.com
  • Received Date: 2019-06-17
  • Rev Recd Date: 2019-08-30
  • Publish Date: 2019-10-15
  • This paper presents a theoretical study on the influences of the device structure parameters on the damage progress of the silicon NPN monolithic composite transistor induced by injection power. The silicon NPN monolithic composite transistors (composed by two successive transistors, T1 and T2) with three different structural parameters are established utilizing the circuit simulator, Sentaurus-TCAD. The dependences of the damage energy threshold and the damage power threshold required to cause the device failure on the pulse-width are obtained. The results show that higher power threshold and more energy are needed to damage the device if the area of the T2 transistor is larger. A study of the damage mechanism is conducted based on the variation analysis of the distributions of the electric field, current density, and temperature in the device. It is found that the distributions of the electric field, current density, and temperature become more dispersed as the area of the T2 transistor increases. It is concluded that when the overall area of the silicon NPN monolithic composite transistor is constant, and as the area ratio of the T2 transistor and the T1 transistor increases, the device becomes less vulnerable to damage. Moreover, the emitter resistor Re has a significant effect on the burnout time. The simulated burnt spot position of the transistor is in good agreement with the experimental result.
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  • [1]
    Kim K, Iliadis A A. Latch-up effects in CMOS inverters due to high power pulsed electromagnetic interference[J]. Solid-State Electronics, 2008, 52(10): 1589-1593. doi: 10.1016/j.sse.2008.06.041
    [2]
    Kim K, Iliadis A A. Operational upsets and critical new bit errors in CMOS digital inverters due to high power pulsed electromagnetic interference[J]. Solid-State Electronics, 2010, 54(1): 18-21. doi: 10.1016/j.sse.2009.09.006
    [3]
    Korte S, Camp M, Garbe H. Hardware and software simulation of transient pulse impact on integrated circuits[C]//2005 International Symposium on Electromagnetic Compatibility. 2005, 2: 489-494.
    [4]
    Liu Yang, Chai Changchun, Yang Yintang, et al. Damage effect and mechanism of the GaAs high electron mobility transistor induced by high power microwave[J]. Chinese Physics B, 2016, 25(4): 465-470.
    [5]
    Chen Jie, Du Zhengwei. Device simulation studies on latch-up effects in CMOS inverters induced by microwave pulse[J]. Microelectronics Reliability, 2013, 53(3): 371-378. doi: 10.1016/j.microrel.2012.10.012
    [6]
    Chen Jie, Du Zhengwei. Understanding and modeling of internal transient latch-up susceptibility in CMOS inverters due to microwave pulses[J]. Microelectronics Reliability, 2013, 53(12): 1891-1896. doi: 10.1016/j.microrel.2013.07.004
    [7]
    Backstrom M G, Lovstrand K G. Susceptibility of electronic systems to high-power microwaves: Summary of test experience[J]. IEEE Trans Electromag Compat, 2004, 46(3): 396-403. doi: 10.1109/TEMC.2004.831814
    [8]
    Kim K, Iliadis A A. Operational upsets and critical new bit errors in CMOS digital inverters due to high power pulsed electromagnetic interference[J]. Solid State Electronics, 2009, 54(1): 18-21.
    [9]
    Ma Zhenyang, Chai Changchun, Ren Xingrong, et al. The damage effect and mechanism of the bipolar transistor caused by microwaves[J]. Acta Physica Sinica, 2012, 61(7): 511-517.
    [10]
    Ma Zhenyang, Chai Changchun, Ren Xingrong, et al. Effects of microwave pulse-width damage on a bipolar transistor[J]. Chinese Physics B, 2012, 21(5): 679-684.
    [11]
    Zhou Huaian, Du Zhengwei, Gong Ke. Transient response of bipolar junction transistor under intense electromagnetic pulse[J]. High Power Laser and Particle Beams, 2005, 17(12): 1861-1864.
    [12]
    Ma Zhenyang, Chai Changchun, Ren Xingrong, et al. The pulsed microwave damage trend of a bipolar transistor as a function of pulse parameters[J]. Chinese Physics B, 2013, 22(2): 538-542.
    [13]
    Ma Zhenyang, Chai Changchun, Ren Xingrong, et al. Microwave damage susceptibility trend of a bipolar transistor as a function of frequency[J]. Chinese Physics B, 2012, 21(9): 565-570.
    [14]
    Ghandi R, Buono B, Domeij M, et al. High current-gain implantation-free 4H-SIC monolithic Darlington transistor[J]. IEEE Electron Device Letters, 2011, 32(2): 188-190.
    [15]
    Zhang Qingchun, Jonas C, O'Loughlin M, et al. A 10-kV monolithic Darlington transistor with β of 336 in 4H-SiC[J]. IEEE Electron Device Letters, 2009, 30(2): 142-144.
    [16]
    Kumar M J, Sharma A. New silicon carbide(SiC) hetero-junction Darlington transistor[C]//2006 Annual IEEE India Conference. 2006.
    [17]
    Tang Y, Chow T P. Monolithic 4H-SIC Darlington transistor with a peak current gain of 2000[C]//61st Device Research Conference. 2003.
    [18]
    Lu Yashi, Zhang Wei, Liu Zhihong, et al. A Darlington SiGe microwave monolithic integrated circuit[C]//2006 IEEE Mediterranean Electrotechnical Conference. 2006.
    [19]
    Chai Changchun, Yang Yintang, Zhang Bing, et al. Mechanism of energy-injection damage of silicon bipolar low-noise amplifiers[J]. J Semicond, 2008(12): 2403-2407.
    [20]
    Li Hui, Chai Changchun, Yang Yintang, et al. Damage effects and mechanism of the silicon NPN monolithic composite transistor induced by high-power microwaves[J]. Chinese Physics B, 2018, 27(8): 637-643.
    [21]
    Wang Qiankun, Chai Changchun, Yang Yintang, et al. The influence of pulsed parameters on the damage of a Darlington transistor[J]. Journal of Semiconductors, 2018, 39(9): 2-47.
    [22]
    Korte S, Camp M, Garbe, H. Hardware and software simulation of transient pulse impact on integrated circuits[C]//IEEE International Symposium on Electromagnetic Compatibility. 2005.
    [23]
    Wunsch D C, Bell R R. Determination of threshold failure levels of semiconductor diodes and transistors due to pulse voltages[J]. IEEE Trans Nuclear Science, 1968, 15(6): 244-259.
    [24]
    Tasca D M. Pulse power failure modes in semiconductors[J]. IEEE Trans Nuclear Science, 1970, 17(6): 364-372.
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