Xie Pengfei, Lei Jun, Lü Wenqiang, et al. Experimental investigation of the package of diode laser chip based on lateral heat flow suppression[J]. High Power Laser and Particle Beams, 2021, 33: 021003. doi: 10.11884/HPLPB202133.200241
Citation: Xie Pengfei, Lei Jun, Lü Wenqiang, et al. Experimental investigation of the package of diode laser chip based on lateral heat flow suppression[J]. High Power Laser and Particle Beams, 2021, 33: 021003. doi: 10.11884/HPLPB202133.200241

Experimental investigation of the package of diode laser chip based on lateral heat flow suppression

doi: 10.11884/HPLPB202133.200241
  • Received Date: 2020-08-18
  • Rev Recd Date: 2020-11-02
  • Publish Date: 2021-01-07

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