Volume 25 Issue 08
Nov.  2013
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Gao Xiaofeng, Wei Jianjun, Zhou Xiuwen, et al. Temperature field simulation of fast cooling of glass-coated pure copper wire[J]. High Power Laser and Particle Beams, 2013, 25: 1970-1974. doi: 10.3788/HPLPB20132508.1970
Citation: Gao Xiaofeng, Wei Jianjun, Zhou Xiuwen, et al. Temperature field simulation of fast cooling of glass-coated pure copper wire[J]. High Power Laser and Particle Beams, 2013, 25: 1970-1974. doi: 10.3788/HPLPB20132508.1970

Temperature field simulation of fast cooling of glass-coated pure copper wire

doi: 10.3788/HPLPB20132508.1970
  • Received Date: 2012-11-20
  • Rev Recd Date: 2013-01-23
  • Publish Date: 2013-06-19
  • The calculate model ,which is the distribution of temperature field of fast cold of pure copper wire covered glass, was established. Using the finite analysis software, the temperature distribution in the cool process was simulated. We have obtained how nodal point temperature changed as the temperature decreased. the influence of the temperature of the cooling water and the velocity of the water on copper wire was investigated. The results show that the glass layer has a temperature difference up to 45 K/m, the copper core has a temperature difference up to 0.12 K/m; and that as the cooling water flow rate increases, the cooling effect increases, when the flow rate reaches 0.5 m/s, the cooling effect is the best; and that when the cooling water temperature ranges from 283 K to 303 K, the cooling effect almost remains unchanged.
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