xie jun, wu wei-dong, du kai, et al. Fabrication technology of Al/Cu impedance match EOS measurement target[J]. High Power Laser and Particle Beams, 2005, 17.
Citation:
xie jun, wu wei-dong, du kai, et al. Fabrication technology of Al/Cu impedance match EOS measurement target[J]. High Power Laser and Particle Beams, 2005, 17.
xie jun, wu wei-dong, du kai, et al. Fabrication technology of Al/Cu impedance match EOS measurement target[J]. High Power Laser and Particle Beams, 2005, 17.
Citation:
xie jun, wu wei-dong, du kai, et al. Fabrication technology of Al/Cu impedance match EOS measurement target[J]. High Power Laser and Particle Beams, 2005, 17.
The fabrication process of Al/Cu impedance-match EOS measurement target was discussed. With the rolling and diffusion-bonding technologies, the Al/Cu impedance-match EOS measurement target was successfully fabricated. The structure and surface roughness of the target were analyzed by AFM, SEM, XRD, and alpha-step 500 device. The surface roughness of the target is smaller than 25 nm. And the Al/Cu diffusion interface zone is narrower than 150 nm.
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