Study of electroless plating for copper hohlraum fabrication

This paper introduces the electroless plating technique to fabricate integral Cu hohlraum on the surface of pretreated PMMA axis. Some parameters effect on the deposition rate and solution stability, such as the CuSO4 content, reducing agent content, pH value and temperature were studied. The optimized mass concentration of CuSO4 is 10~20 g/L, TART·K·Na is 10~30 g/L, EDTA·2Na is 10~28 g/L, additive is 10 mg/L, the volumic concetration of HCHO is 10~25 mL/L, pH value is 12~13, and the base temperature is 35~65 ℃. The feasible technics of electroless Cu plating are confirmed base on experimental result. According to the technics, Cu hohlraum with thickness of 10～25 μm was obtained and there were not flaw and indentations on the surface. After the axis was removed by chemical etching, t