Numerical simulation of a microchannel cooler

liu ting-ting; gao yang; li lei-min; hu li; 

Volume 17 Issue 05s

May 2005

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liu ting-ting, gao yang, li lei-min, et al. Numerical simulation of a microchannel cooler[J]. High Power Laser and Particle Beams, 2005, 17.

Citation:

liu ting-ting, gao yang, li lei-min, et al. Numerical simulation of a microchannel cooler[J]. High Power Laser and Particle Beams, 2005, 17.

liu ting-ting, gao yang, li lei-min, et al. Numerical simulation of a microchannel cooler[J]. High Power Laser and Particle Beams, 2005, 17.

Citation:

liu ting-ting, gao yang, li lei-min, et al. Numerical simulation of a microchannel cooler[J]. High Power Laser and Particle Beams, 2005, 17.

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Numerical simulation of a microchannel cooler

1.
Information and Control Engineering College,Southwest University of Science and Technology,Mianyang 621010,China;
2.
Institute of Electronic Engineering,CAEP,P.O.Box 919-512,Mianyang 621900,China

Publish Date: 2005-05-20

Abstract

Abstract

Microchannel heat sinks are minute channels fabricated onto the back of the thin silicon chip substrate with hydraulic diameter ranging from 10 to 103 μm. Microchannels have the advantage of large surface area to volume ratio, low thermal resistances and low flux, so they are thought to be an effective solution in dissipating thermal. One typical application is the cooling of the laser diode arrays. Because flow and heat transfer in microchannel are different from those in macro one, further research is necessary. An FEA (finite element analysis) model of a flat plate microchannel is set up in this paper using commercial software CoventorWareTM to investigate the localized flow and heat transfer in a single microchannel, computation results are also presented and analyzed. Microchannel is
- micro electromechanical system,
- microchannel,
- cooler

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