Volume 17 Issue 05s
May  2005
Turn off MathJax
Article Contents
li qi-feng, l wen-qiang, wu de-yong, et al. Fabrication of V-shaped silicon microchannel cooler[J]. High Power Laser and Particle Beams, 2005, 17.
Citation: li qi-feng, l wen-qiang, wu de-yong, et al. Fabrication of V-shaped silicon microchannel cooler[J]. High Power Laser and Particle Beams, 2005, 17.

Fabrication of V-shaped silicon microchannel cooler

  • Publish Date: 2005-05-20
  • A V-shaped Silicon microchannel cooler has an advantage of packaging compact laser diode arrays due to its high cooling power and specific structure. The structure and fabrication process of the V-shaped silicon microchannel cooler are reported. The cooler contains a silicon wafer and a glass manifold. The silicon wafer contains V-shaped grooves and microchannels of 30 μm wide which are etched by anisotropic etching after being photolithed. The whole cooler is formed by bonding silicon wafer to glass manifold. Some coolers were fabricated and tested. The results show that it has a thermal impedance of 0.051 ℃·cm2/W for the single groove facet that match the results of numerical simulation. The cooler meets the requirement for packaging laser diode arrays with a peak power density up t
  • loading
  • 加载中

Catalog

    通讯作者: 陈斌, bchen63@163.com
    • 1. 

      沈阳化工大学材料科学与工程学院 沈阳 110142

    1. 本站搜索
    2. 百度学术搜索
    3. 万方数据库搜索
    4. CNKI搜索
    Article views (1912) PDF downloads(494) Cited by()
    Proportional views
    Related

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return