chu guang, luo jiang-shan, liu wei, et al. Investigation of nanocrystalline Cu by X-ray diffraction and positron annihilation[J]. High Power Laser and Particle Beams, 2006, 18.
Citation:
chu guang, luo jiang-shan, liu wei, et al. Investigation of nanocrystalline Cu by X-ray diffraction and positron annihilation[J]. High Power Laser and Particle Beams, 2006, 18.
chu guang, luo jiang-shan, liu wei, et al. Investigation of nanocrystalline Cu by X-ray diffraction and positron annihilation[J]. High Power Laser and Particle Beams, 2006, 18.
Citation:
chu guang, luo jiang-shan, liu wei, et al. Investigation of nanocrystalline Cu by X-ray diffraction and positron annihilation[J]. High Power Laser and Particle Beams, 2006, 18.
The nanocrystalline Cu was prepared by flow-levitation-cold-pressing method under different pressures and then annealed at different temperatures with different annealing time. The X-ray diffraction (XRD) and positron annihilation spectroscopy (PAS) were used to determine the structure and microdefects in the nanocrystallie Cu. The XRD analysis results show that the grain size of the specimen after being pressed is 20 nm and does not grow prominently after annealing below 300℃ for 3 h. The PAS analysis results show that most of the defects in the specimen after press is vacancies and vacancy-clusters, the amount of micro-voids is small; after being annealed at high temperature or for a long time, the vacancies aggregate together to form vacancy-cluster by diffusion, the micro-voids break
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