Effects of sputtering power on structure and properties of Ti films deposited by DC magnetron sputtering

Pure Ti films were fabricated by DC magnetron sputtering. The deposition rate, surface roughness, crystal structure and stress of Ti films at different sputtering power were studied. The deposition rate in-creases with the increase of the sputtering power. The AFM images show that the films are compact and smooth, and the minimum RMS is 0.9 nm when the sputtering power is 20 W. The X-ray diffraction results indicate that the Ti films are hexagonal structure. The stress in the Ti films increases firstly and reaches a maximum stress of 945.1 MPa when the sputtering power is 60 W, then decreases with higher sputtering power.