High density packaging diode laser

gao song-xin; wu de-yong; lei jun; tang chun; liu yong-zhi

Volume 20 Issue 09

Sep. 2008

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wang yinglong, luo qingshan, deng zechao, et al. Influence of additional gas flow on size distribution of Si nanoparticles deposited by pulsed laser ablation[J]. High Power Laser and Particle Beams, 2010, 22.

Citation:

gao song-xin, wu de-yong, lei jun, et al. High density packaging diode laser[J]. High Power Laser and Particle Beams, 2008, 20.

Citation:

gao song-xin, wu de-yong, lei jun, et al. High density packaging diode laser[J]. High Power Laser and Particle Beams, 2008, 20.

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High density packaging diode laser

1.
Institute of Applied Electronics,CAEP,P.O.Box 919-1013,Mianyang 621900,China;
2.
School of Optoelectronic Information,University of Electronic Science and Technology of China,Chengdu 610054,China

Publish Date: 2008-09-15

Abstract

Abstract

The heat dispersion of a cooler which we made was theoretically simulated and the thermal conductivity of the packaging material was analyzed. It was proved the diode laser could operate in high power density and high duty cycle. The key technique for high density packaging was improved. The thickness of the gilded heat sink was 3~5 mm, and that of the solder was 4~7 mm. The thermal resistance of the packaged LD bar was 0.115 ℃/W. The output power of the diode laser arrays was 986 W when the current was 100 A and the duty cycle 15%. The slope efficiency of each bar was 1.25 W/A and the current threshold was about 20 A. The peak power density could be as high as 1.5 kW/cm2 when the duty-cycle was 15%.
- diode laser,
- high density packaging,
- passive cooling stack,
- heat sink,
- thermal resistance

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