Fabrication and detection technique of fused silica substrate with extremely low subsurface damage

ma bin; shen zhengxiang; zhang zhong; he pengfei; ji yiqin; liu huasong; liu dandan; wang zhanshan

Volume 22 Issue 09

Aug. 2010

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Article Navigation > High Power Laser and Particle Beams > 2010 > 22(09): 0-

gao yi, yang hailiang, sun fengju, et al. Resistance-voltage-dividing load for testing of pulsed power equipment[J]. High Power Laser and Particle Beams, 2009, 21.

Citation:

ma bin, shen zhengxiang, zhang zhong, et al. Fabrication and detection technique of fused silica substrate with extremely low subsurface damage[J]. High Power Laser and Particle Beams, 2010, 22.

gao yi, yang hailiang, sun fengju, et al. Resistance-voltage-dividing load for testing of pulsed power equipment[J]. High Power Laser and Particle Beams, 2009, 21.

Citation:

ma bin, shen zhengxiang, zhang zhong, et al. Fabrication and detection technique of fused silica substrate with extremely low subsurface damage[J]. High Power Laser and Particle Beams, 2010, 22.

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Fabrication and detection technique of fused silica substrate with extremely low subsurface damage

1.
Institute of Precision Optical Engineering,Tongji University,Shanghai 200092,China;
2.
School of Aerospace Engineering and Applied Mechanics,Tongji University,Shanghai 200092,China;
3.
Tianjin Key Laboratory of Optical Thin Films,Tianjin Jinhang Institute of Technical Physics,Tianjin 300192,China

Publish Date: 2010-08-17

Abstract

Abstract

The supersmooth optical substrate with extremely low subsurface damage is essential to obtain high laser damage threshold films. In view of the difference in subsurface morphology, the laser confocal microscope technique combined with light scattering method is firstly used to detect the subsurface defects of fused silica substrates ground by brand W10 and W5 SiC abrasive particles, and the relation between the defects size and the scattering intensity are discussed. Then chemical etching method is introduced to expose the inner features at arbitrary depth for the polished sample, the influences of chemical resultant and redeposition layer on etching rate are analyzed, and the distribution and depth of damage layer are estimated. Furthermore, the relation between RMS roughness and etching
- subsurface damage,
- confocal scanning microscope,
- light scattering,
- chemical etching,
- etching rate

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