Volume 22 Issue 11
Sep.  2010
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gao songxin, lei jun, guo linhui, et al. Packaging technique of CW 100 W quantum-well diode laser[J]. High Power Laser and Particle Beams, 2010, 22.
Citation: gao songxin, lei jun, guo linhui, et al. Packaging technique of CW 100 W quantum-well diode laser[J]. High Power Laser and Particle Beams, 2010, 22.

Packaging technique of CW 100 W quantum-well diode laser

  • Publish Date: 2010-09-29
  • In order to increase out power of DL, the copper micro-channel cooler’s property was tested, and its ability to dissipate heat was analyzed. An indium alloy solder was developed, which can dispel crystal beard. The CW 100 W high power laser diode was packaged directly on the cooler with new technique and tested. The results of measurement show that the CW 100 W laser diode output power more than 100 W at drive current of 105 A, the central wavelengh is 808.5 nm and the FWHM is 2.15 nm. The smile effect of the packaged diode bars is usually less than 2 μm, for some samples, it is even less than 0.5 μm.
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