By combining the methods of spray cooling heat transfer and micro-grooves phase change heat transfer, we design a heat sink based on throttle microgrooves phase change cooling theory. It has been proved by experiments that the vaporization rate of the coolant in the microgrooves of the cooler had reached 70%. The cooling efficiency increased rapidly while the coolant flow became smaller and the thermal management unit lighter. At the same time, we investigated the packaging of laser diode stacks with back surface cooling heat sink. Using the new technique of compound heat sink, AuSn alloy solder and the multi interface soldering, we completed the packaging of quasi-continuous wave (QCW) 3 kW laser diode stacks, with a packing spacing of 1.3 mm. It has been proved by experiments that this u