Thermal stability of nanocrystalline intermetallic compound Cu4Al powder

wei jian-jun; tang yong-jian; wang chao-yang; wu wei-dong; wang xiao-qin

Volume 17 Issue 12

Dec. 2005

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Zhu Heng, Liu Xialai, Huang Jinyong, et al. Polishing of large-aperture reflective SiC mirror using computer-controlled optical surfacing[J]. High Power Laser and Particle Beams, 2013, 25: 3311-3314. doi: 3311

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wei jian-jun, tang yong-jian, wang chao-yang, et al. Thermal stability of nanocrystalline intermetallic compound Cu4Al powder[J]. High Power Laser and Particle Beams, 2005, 17.

Citation:

wei jian-jun, tang yong-jian, wang chao-yang, et al. Thermal stability of nanocrystalline intermetallic compound Cu4Al powder[J]. High Power Laser and Particle Beams, 2005, 17.

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Thermal stability of nanocrystalline intermetallic compound Cu4Al powder

1.
Research Center of Laser Fusion,CAEP,P.O.Box 919-987,Mianyang 621900,China;
2.
Institute of Atomic and Molecular Physics,Sichuan University,Chengdu 610065,China

Publish Date: 2005-12-15

Abstract

Abstract

Thermal stability of nanocrystalline intermetallic compound Cu4Al obtained from flow-levitation method is studied by means of DTA (Differential Thermal Analysis) and XRD (X-Ray Diffraction). By DTA experiments on Cu4Al nanopowder, three endothermal peaks at 258 ℃, 423 ℃ and 537 ℃ on DTA curve were found. By XRD experiments on original sample and its heat-treating samples, the results show that the endothermal peak at 537 ℃ is related to the structure phase transition from nanostructure Cu4Al to Cu3Al, accompanying growing up of Cu3Al crystalline grain. The test results are compared and it can be seen that Cu4Al nanopowder possess a nice thermal stability below 440 ℃，and it will bring about phase transition above 537 ℃.
- powder of nanocomposite cu4al,
- intermetallic compound,
- thermal stability,
- structure phase transition,
- icf target materials

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